Government Clears Rs 1.25 Lakh Crore Outlay for India Semiconductor Mission 2.0, Cabinet Approval Next
The Expenditure Finance Committee has approved a proposed outlay of Rs 1.25 lakh crore for India Semiconductor Mission 2.0, clearing the way for Union Cabinet consideration. The expanded mission will cover semiconductor chip design, fabrication, and packaging, reflecting the government's stronger commitment to building a comprehensive domestic semiconductor ecosystem.
According to the approved proposal, the Expenditure Finance Committee cleared the Rs 1.25 lakh crore outlay during its meeting held last week, paving the way for the second phase of the India Semiconductor Mission to move to the Union Cabinet for its final approval.
Sources indicated that India Semiconductor Mission 2.0 will focus on the entire semiconductor value chain, significantly expanding the scope of the government's semiconductor strategy. The new phase is expected to cover semiconductor chip design, fabrication, and packaging, reflecting a comprehensive approach to building a robust domestic semiconductor industry.
The proposed allocation of Rs 1.25 lakh crore is substantially higher than the Rs 76,000 crore sanctioned under the first phase of the India Semiconductor Mission. The increased financial commitment underscores the government's continued emphasis on developing a self-reliant semiconductor manufacturing ecosystem and strengthening India's position across the global semiconductor value chain.
With the Expenditure Finance Committee's approval now in place, the proposal is set to be presented before the Union Cabinet for its final decision. The move represents a major advancement in India's long-term strategy to expand domestic semiconductor capabilities through enhanced investment across design, manufacturing, and packaging, reinforcing the country's commitment to building a competitive and resilient semiconductor ecosystem.

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