Odisha Secures $3.3 Billion Semiconductor Investment as Intel Backs Advanced AI Chip Component Plant

The proposed facility will manufacture glass-core substrates, a critical component used in artificial intelligence chips, high-performance computing systems, and defense technologies. The project marks a significant step toward strengthening India's domestic semiconductor supply chain and reducing dependence on imported advanced chip components.

Under the agreement, Intel will provide technological expertise and workforce training support for the plant. The collaboration is expected to accelerate the development of a skilled talent base while supporting the growth of advanced semiconductor manufacturing capabilities in the region.

Government officials stated that the facility is projected to create more than 1,800 skilled jobs, generating substantial employment opportunities and attracting a network of ancillary industries to support operations. The investment is also expected to stimulate broader economic activity within Odisha's emerging technology ecosystem.

Union Minister Ashwini Vaishnaw welcomed the agreement, describing it as a strong endorsement of India's semiconductor and industrial policies. He said the investment reflects growing confidence among global technology companies in the country's vision for building a self-reliant semiconductor ecosystem.

The landmark agreement positions Odisha as an important destination in India's expanding semiconductor landscape and underscores the nation's commitment to developing advanced manufacturing infrastructure for next-generation technologies, including artificial intelligence, high-performance computing, and strategic defense applications.