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Hardware on Demand: Tecno Unveils Ultra-Thin Modular Concept at MWC 2026
Tecno has unveiled an ultra-thin 4.9mm modular smartphone at MWC 2026, featuring "Modular Magnetic Interconnection Technology." The prototype allows users to snap on battery packs, 20x zoom lenses, and gaming grips via pogo pins. While the ATOM and MODA editions impressed crowds, experts weigh the concept against past failures like Google's Project Ara 